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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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RN52 датащи(PDF) 15 Page - Microchip Technology |
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RN52 датащи(HTML) 15 Page - Microchip Technology |
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15 / 26 page  2015 Microchip Technology Inc. DS70005120A-page 15 RN52 2.6 Solder Reflow Profile The lead-free solder reflow temperature and times are: • Temperature – 230° C, 60 seconds maximum, peak 245° C maximum • Preheat temperature – 165° ± 15° C, 90 to 120 seconds • Time – Single pass, one time To reflow solder the module onto a PCB, use an RoHS- compliant solder paste equivalent to NIHON ALMIT paste or OMNIX OM-310 solder paste from Alpha met- als. See Table 2-2. Figure 2-5 and Figure 2-6 show the solder reflow temperature profiles. FIGURE 2-5: SOLDER REFLOW TEMPERATURE PROFILE Note: Use no-clean flux and DO NOT water wash. TABLE 2-2: PASTE SOLDER RECOMMENDATIONS Manufacturer Part Number Metal Composition Liquidus Temperature Alpha Metals http://www.alphametals.com OMNIX OM-310 SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) ~220°C NIHON ALMIT Co. LTD http://almit.co.jp LFM-70W INP 88% Sn, 3.5% Ag, 0.5% Bi, 8% In ~215°C |
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