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TLV2760IDBVR датащи(PDF) 17 Page - Texas Instruments |
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TLV2760IDBVR датащи(HTML) 17 Page - Texas Instruments |
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17 / 27 page ![]() TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUT DOWN SLOS326D – JUNE 2000 – REVISED FEBRUARY 2001 17 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION general power dissipation considerations (continued) 1 0.75 0.5 0 –55 –40 –25 –10 5 1.25 1.5 MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 1.75 20 35 50 0.25 TA – Free-Air Temperature – °C 2 65 80 95 110 125 MSOP Package Low-K Test PCB θJA = 260°C/W TJ = 150°C PDIP Package Low-K Test PCB θJA = 104°C/W SOIC Package Low-K Test PCB θJA = 176°C/W SOT-23 Package Low-K Test PCB θJA = 324°C/W NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 35. Maximum Power Dissipation vs Free-Air Temperature |
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