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TLV2760IDBVR датащи(PDF) 16 Page - Texas Instruments |
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TLV2760IDBVR датащи(HTML) 16 Page - Texas Instruments |
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16 / 27 page ![]() TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUT DOWN SLOS326D – JUNE 2000 – REVISED FEBRUARY 2001 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION circuit layout considerations (continued) D Sockets—Socketscan be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation. D Short trace runs/compact part placements—Optimum high performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at the input of the amplifier. D Surface-mount passive components—Using surface-mount passive components is recommended for high performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. shutdown function Three members of the TLV276x family (TLV2760/3/5) have a shutdown terminal for conserving battery life in portable applications. When the shutdown terminal is pulled low, the supply current is reduced to 10 nA/channel, the amplifier is disabled, and the outputs are placed in a high impedance mode. To enable the amplifier, the shutdown terminal must be pulled high. The shutdown terminal should never be left floating. If the shutdown feature is not desired, directly tie the shutdown terminal to the positive rail. The shutdown terminal threshold is always referenced to the GND terminal of the device. Therefore, when operating the device with split supply voltages (e.g. ±1.8 V), the shutdown terminal needs to be pulled to the negative rail, not the system ground, to disable the operational amplifier. The amplifier is powered with a single 2.4-V supply and configured as a noninverting configuration with a unity gain. Turnon and turnoff times are defined as the interval between application of the logic signal to the shutdown pin and the point at which the supply current has reached half its final value. The times for the single, dual, and quad are listed in the data tables. general power dissipation considerations For a given θJA, the maximum power dissipation is shown in Figure 35 and is calculated by the following formula: P D + T MAX –T A q JA Where: PD = Maximum power dissipation of TLV276x IC (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-ambient air temperature ( °C) θJA = θJC + θCA θJC = Thermal coefficient from junction to case θCA = Thermal coefficient from case to ambient air (°C/W) |
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