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TLV2760IDBVR датащи(PDF) 16 Page - Texas Instruments

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номер детали TLV2760IDBVR
подробное описание детали  FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUT DOWN
PDF  27 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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TLV2760IDBVR датащи(HTML) 16 Page - Texas Instruments

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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUT DOWN
SLOS326D – JUNE 2000 – REVISED FEBRUARY 2001
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
circuit layout considerations (continued)
D Sockets—Socketscan be used but are not recommended. The additional lead inductance in the socket pins
will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board
is the best implementation.
D Short trace runs/compact part placements—Optimum high performance is achieved when stray series
inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,
thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of
the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at
the input of the amplifier.
D Surface-mount passive components—Using surface-mount passive components is recommended for high
performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
shutdown function
Three members of the TLV276x family (TLV2760/3/5) have a shutdown terminal for conserving battery life in
portable applications. When the shutdown terminal is pulled low, the supply current is reduced to 10 nA/channel,
the amplifier is disabled, and the outputs are placed in a high impedance mode. To enable the amplifier, the
shutdown terminal must be pulled high. The shutdown terminal should never be left floating. If the shutdown
feature is not desired, directly tie the shutdown terminal to the positive rail. The shutdown terminal threshold
is always referenced to the GND terminal of the device. Therefore, when operating the device with split supply
voltages (e.g.
±1.8 V), the shutdown terminal needs to be pulled to the negative rail, not the system ground,
to disable the operational amplifier.
The amplifier is powered with a single 2.4-V supply and configured as a noninverting configuration with a unity
gain. Turnon and turnoff times are defined as the interval between application of the logic signal to the shutdown
pin and the point at which the supply current has reached half its final value. The times for the single, dual, and
quad are listed in the data tables.
general power dissipation considerations
For a given
θJA, the maximum power dissipation is shown in Figure 35 and is calculated by the following formula:
P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of TLV276x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)



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