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TMS320C6711 датащи(PDF) 67 Page - Texas Instruments |
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TMS320C6711 датащи(HTML) 67 Page - Texas Instruments |
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67 / 129 page ![]() TMS320C6711, TMS320C6711B, TMS320C6711C, TMS320C6711D FLOATING-POINT DIGITAL SIGNAL PROCESSORS SPRS088L − FEBRUARY 1999 − REVISED MAY 2004 67 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 electrical characteristics over recommended ranges of supply voltage and operating case temperature† (unless otherwise noted) for C6711C/C6711D only PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage (C6711C/11D) All signals except CLKS1 and DR1 DVDD = MIN, IOH = MAX 2.4 V VOL Low-level output lt (C6711C/11D) All signals except CLKS1 and DR1 DVDD = MIN, IOL = MAX 0.4 V VOL voltage (C6711C/11D) CLKS1 and DR1 DVDD = MIN, IOL = MAX 0.4 V II Input current C6711C/11D: All signals except CLKS1 and DR1 VI = VSS to DVDD ±170 uA II Input current C6711C/11D: CLKS1 and DR1 VI VSS to DVDD ±10 uA IOZ Off-state output current C6711C/11D: All signals except CLKS1 and DR1 VO = DVDD or 0 V ±170 uA IOZ current C6711C/11D: CLKS1 and DR1 VO DVDD or 0 V ±10 uA IDD2V Core supply current‡ C6711D, CVDD = 1.4 V, CPU clock = 250 MHz 810 mA I Core supply current‡ C6711C, CVDD = 1.26 V, CPU clock = 200 MHz 560 mA IDD2V Core supply current‡ C6711D, CVDD = 1.26 V, CPU clock = 200 MHz 560 mA I Core supply current‡ C6711C, CVDD = 1.26 V, CPU clock = 167 MHz 475 mA IDD2V Core supply current‡ C6711D, CVDD = 1.26 V, CPU clock = 167 MHz 475 mA IDD3V I/O supply current‡ 11C/11D, DVDD = 3.3 V, EMIF speed = 100 MHz 75 mA Ci Input capacitance (C6711C/11D) 7 pF Co Output capacitance (C6711C/11D) 7 pF † For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table. ‡ For the C6711C/C6711D device, these currents were measured with average activity (50% high/50% low power) at 25°C case temperature and 100-MHz EMIF. This model represents a device performing high-DSP-activity operations 50% of the time, and the remainder performing low-DSP-activity operations. The high/low-DSP-activity models are defined as follows: High-DSP-Activity Model: CPU: 8 instructions/cycle with 2 LDDW instructions [L1 Data Memory: 128 bits/cycle via LDDW instructions; L1 Program Memory: 256 bits/cycle; L2/EMIF EDMA: 50% writes, 50% reads to/from SDRAM (50% bit-switching)] McBSP: 2 channels at E1 rate Timers: 2 timers at maximum rate Low-DSP-Activity Model: CPU: 2 instructions/cycle with 1 LDH instruction [L1 Data Memory: 16 bits/cycle; L1 Program Memory: 256 bits per 4 cycles; L2/EMIF EDMA: None] McBSP: 2 channels at E1 rate Timers: 2 timers at maximum rate The actual current draw is highly application-dependent. For more details on core and I/O activity, refer to the TMS320C6713/12C/11C Power Consumption Summary application report (literature number SPRA889). |
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