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CC2650MODAMOHT датащи(PDF) 37 Page - Texas Instruments

номер детали CC2650MODAMOHT
подробное описание детали  Low energy Wireless MCU Module
PDF  40 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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CC2650MODAMOHT датащи(HTML) 37 Page - Texas Instruments

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CC2650MODA
www.ti.com
SWRS187A – AUGUST 2016 – REVISED AUGUST 2016
Submit Documentation Feedback
Product Folder Links: CC2650MODA
Mechanical, Packaging, and Orderable Information
Copyright © 2016, Texas Instruments Incorporated
In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and
university programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the
chance to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support,
Texas Instruments offers the broadest low-power RF portfolio.
8.8
Trademarks
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
SmartRF, Code Composer Studio, SimpleLink, Z-Stack, TI-RTOS, E2E are trademarks of Texas
Instruments.
ARM7 is a trademark of ARM Limited (or its subsidiaries).
ARM, Cortex, Thumb are registered trademarks of ARM Limited (or its subsidiaries).
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
IEEE Std 1241 is a trademark of The Institute of Electrical and Electronics Engineers, Inc.
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
ZigBee is a registered trademark of ZigBee Alliance, Inc.
ZigBee RF4CE is a trademark of Zigbee Alliance, Inc.
All other trademarks are the property of their respective owners.
8.9
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.10 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from Disclosing party under
this Agreement, or any direct product of such technology, to any destination to which such export or re-
export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from
U.S. Department of Commerce and other competent Government authorities to the extent required by
those laws.
8.11 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
9
Mechanical, Packaging, and Orderable Information
9.1
Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.



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