CC2650MODAMOHT datasheet(16/40 Pages) TI1

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CC2650MODA

SWRS187A – AUGUST 2016 – REVISED AUGUST 2016

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Specifications

(1)

°C/W = degrees Celsius per watt.

(2)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

(3)

m/s = meters per second.

5.22 Thermal Resistance Characteristics for MOH Package

NAME

DESCRIPTION

°C/W(1) (2)

AIR FLOW (m/s)(3)

RΘJC

Junction-to-case

20.0

RΘJB

Junction-to-board

15.3

RΘJA

Junction-to-free air

29.6

RΘJMA

Junction-to-moving air

25.0

PsiJT

Junction-to-package top

8.8

PsiJB

Junction-to-board

14.8

(1)

For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDD input capacitor (see

Section 7.1.1) must be used to ensure compliance with this slew rate.

(2)

Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see

Section 5.14).

(3)

TA = –40°C to +85°C, VDD = 1.7 V to 3.8 V, unless otherwise noted.

(4)

Tc = 25°C, VDD = 3.0 V, unless otherwise noted. Device operating as slave. For SSI master operation, see Section 5.24.

(5)

Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.

5.23 Timing Requirements

MIN

NOM

MAX

UNIT

Rising supply-voltage slew rate

100

mV/µs

Falling supply-voltage slew rate

mV/µs

Falling supply-voltage slew rate, with low-power flash settings(1)

mV/µs

Positive temperature gradient in standby(2)

No limitation for negative

temperature gradient, or

outside standby mode

°C/s

CONTROL INPUT AC CHARACTERISTICS(3)

RESET_N low duration

µs

SYNCHRONOUS SERIAL INTERFACE (SSI)(4)

S1 (SLAVE)(5)

tclk_per

SSIClk period

65024

System

clocks

S2(5)

tclk_high

SSIClk high time

0.5

tclk_per

S3(5)

tclk_low

SSIClk low time

0.5

tclk_per

5.24 Switching Characteristics

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDD = 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

WAKEUP AND TIMING

Idle

→ Active

µs

Standby

→ Active

151

µs

Shutdown

→ Active

1015

µs

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