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DS3884AVF датащи(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали DS3884AVF
подробное описание детали  BTL Handshake Transceiver
PDF  8 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

DS3884AVF датащи(HTML) 3 Page - National Semiconductor (TI)

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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
6.5V
Control Input Voltage
6.5V
Driver Input and Receiver Output
5.5V
Receiver Input Current
±15 mA
Bus Termination Voltage
2.4V
Power Dissipation at 25˚C
PQFP
1.3W
Derate PQFP Package
11.1 mW/˚C
Storage Temperature Range
−65˚C to +150˚C
Lead Temperature
(Soldering, 4 seconds):
260˚C
Recommended Operating
Conditions
Supply Voltage, V
CC
4.5V–5.5V
Bus Termination Voltage (V
T)
2.06V–2.14V
Operating Free Air Temperature
0˚C to 70˚C
DC Electrical Characteristics (Notes 2, 3)
T
A = 0 to +70˚C, V CC =5V ±10%
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRIVER AND CONTROL INPUT: (Dn, DE*, PS1 and PS2)
V
IH
Minimum Input High Voltage
2.0
V
V
IL
Maximum Input Low Voltage
0.8
V
I
I
Input Leakage Current
V
IN =V CC = 5.5V
100
µA
I
IH
Input High Current
V
IN = 2.4V
40
µA
I
IL
Input Low Current
V
IN = 0.5V
−100
µA
V
CL
Input Diode Clamp Voltage
I
CLAMP = −12 mA
−1.2
V
DRIVER OUTPUT/RECEIVER INPUT: (Bn)
V
OLB
Output Low Bus Voltage
Dn = 2.4V, DE* = 0V,
0.75
1.0
1.1
V
(Note 5)
I
OL =80 mA
I
OLBZ
Output Low Bus Current
Dn = 0.5V, DE* = 2.4V, Bn = 0.75V
100
µA
I
OHBZ
Output High Bus Current
Dn = 0.5V, DE* = 2.4V, Bn = 2.1V
100
µA
I
OLB
Output Low Bus Current
Dn = 0.5V, DE* = 0V, Bn = 0.75V
220
µA
I
OHB
Output High Bus Current
Dn = 0.5V, DE* = 0V, Bn = 2.1V
350
µA
V
TH
Receiver Input Threshold
DE* = 2.4V
1.47
1.55
1.62
V
V
CLP
Positive Clamp Voltage
V
CC = Max or 0V, IBn = 1 mA
2.4
3.4
4.5
V
V
CC = Max or 0V, IBn = 10 mA
2.9
3.9
5.0
V
V
CLN
Negative Clamp Voltage
I
CLAMP = −12 mA
−1.2
V
RECEIVER OUTPUT: (FRn and Rn)
V
OH
Voltage Output High
Bn = 1.1V, DE* = 2.4V, I
OH = −2 mA
2.4
3.2
V
V
OL
Voltage Output Low
Bn = 2.1V, DE* = 2.4V, I
OL = 24 mA
0.35
0.5
V
Bn = 2.1V, DE* = 2.4V, I
OL = 8 mA
0.35
0.4
V
I
OS
Output Short Circuit Current
Bn = 1.1V, DE* = 2.4V (Note 4)
−40
−70
−100
mA
SUPPLY CURRENT
I
CC
Supply Current: Includes V
CC,DE* = 0.5V, All Dn = 2.4V
50
70
mA
QV
CC and LI
DE* = 2.4V, All Bn = 2.1V
50
70
mA
I
LI
Live Insertion Current
DE* = 2.4V, All Dn = 0.5V
1
3
mA
DE* = 0.5V, All Dn = 2.4V
2
5
mA
Note 1: “Absolute Maximum Ratings” are those beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should
be operated at these limits. The table of “Electrical Characteristics” provide conditions for actual device operation.
Note 2:
All input and/or output pins shall not exceed VCC plus 0.5V and shall not exceed the absolute maximum rating at anytime, including power-up and
power-down. This prevents the ESD structure from being damaged due to excessive currents flowing from the input and/or output pins to QV CC and VCC. There is
a diode between each input and/or output to VCC which is forward biased when incorrect sequencing is applied. Alternatively, a current limiting resistor can be used
when pulling-up the inputs to prevent damage. The current into any input/output pin shall be no greater than 50 mA. Exception, LI and Bn pins do not have power
sequencing requirements with respect to VCC and QVCC. Furthermore, the difference between VCC and QVCC should never be greater than 0.5V at any time including
power-up.
Note 3: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified.
All typical values are specified under these conditions.: VCC = 5V and TA = 25˚C unless otherwise stated.
Note 4: Only one output should be shorted at a time, and duration of the short should not exceed one second.
Note 5: Referenced to appropriate signal ground. Do not exceed maximum power dissipation of package.
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