LP3936SLSLASHNOPB datasheet(3/30 Pages) TI1

3 / 30 page

LP3936

www.ti.com

SNVS259D – NOVEMBER 2003 – REVISED MAY 2013

Pin Description (continued)

Name

Type

Description

NRST

Logic Input

Low Active Reset Input

Logic Input/Output

MicroWire Chip-Select (in) / I2C SDA (in/out)

Logic Output

MicroWire Data Output

Logic Input

MicroWire Data Input

SCL

Logic Input

MicroWire Clock / I2C SCL Input

RGB_EN

Logic Input

LED Control for On/Off or PWM Dimming

VDD_IO

Power

Supply Voltage for Logic IO signals

ROUT

LED Output

Open Drain Output, Red LED

GOUT

LED Output

Open Drain Output, Green LED

BOUT

LED Output

Open Drain Output, Blue LED

GND_RGB

Ground

Ground for RGB Drivers

OUT

Output

Open Drain, Boost Converter Power Switch

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

VDD1, VDD2, VDD_IO, V(OUT, FB)

-0.3V to 6.0V

Voltage on Logic Pins

-0.3V to VDD_IO + 0.3V, with 6.0V max

Voltage on LED Output Pins

-0.3V to V(FB) + 0.3V, with 6.0V max

Voltage on All Other Pins

-0.3V to VDD1,2 + 0.3V, with 6.0V max

I (ROUT, GOUT, BOUT)

150 mA

I (VREF)

10 µA

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJ-MAX)

125°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature (Reflow soldering, 3 times)(5)

260°C

ESD Rating(6)

Human Body Model:

2 kV

Machine Model:

200V

(1)

All voltages are with respect to the potential at the GND pins (GND1, GND2, GND_T, GND_BOOST, GND_WLED, GND_RGB).

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics table.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for

availability and specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and

disengages at TJ = 140°C (typ.).

(5)

For detailed soldering specifications and information, see TI's AN--1125 Application Report (SNAA002).

(6)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

Operating Ratings

(1) (2)

VDD1, VDD2

3.0V to 6.0V

VDD_IO

1.65V – VDD1,2

Recommended Load Current

0 mA to 250 mA

Junction Temperature (TJ) Range

−40°C to +125°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pins (GND1, GND2, GND_T, GND_BOOST, GND_WLED, GND_RGB).

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