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MB91F528 датащи(PDF) 238 Page - SPANSION |
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MB91F528 датащи(HTML) 238 Page - SPANSION |
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238 / 241 page ![]() D at aS h ee t 208-pin plastic TEQFP Lead pitch 0.50 mm Package width × package length 28.00 mm × 28.00 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max. Weight 2.55 g Code (Reference) P-TEQFP208-28×28-0.50 208-pin plastic TEQFP (FPT-208P-M36) (FPT-208P-M36) 0.22±0.05 (.009±.002) *28.00±0.10(1.142±.004) SQ 30.00±0.20(1.181±.008) SQ 0.145±0.055 1.50 (.059 ) 0 ˚~8˚ 0.25(.010) 0.10±0.10 (.004±.004) INDEX Details of "A" part (.020) 0.60±0.15 (.024±.006) "A" 0.50 1 52 104 53 156 105 208 157 (.006±.002) M 0.08(.003) 0.08(.003) (9.26(.365) SQ) C 2013 FUJITSU SEMICONDUCTOR LIMITED HMbF208-36Sc-1-1 (8.06(.317) SQ) (Mounting height) (STAND OFF) +0.20 -0.10 +.008 -.004 Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/ March 28, 2014, MB91F528_DS705-00016-1v0-E 235 CONFIDENTIAL |
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