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MB91F528 датащи(PDF) 237 Page - SPANSION |
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MB91F528 датащи(HTML) 237 Page - SPANSION |
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237 / 241 page ![]() D at aS h ee t 176-pin plastic TEQFP Lead pitch 0.50 mm Package width × package length 24.00 mm × 24.00 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max. Weight 1.86 g Code (Reference) P-TEQFP176-24×24-0.50 176-pin plastic TEQFP (FPT-176P-M18) (FPT-176P-M18) 0.22±0.05 (.009±.002) *24.00±0.10(.945±.004) SQ 26.00±0.20(1.024±.008) SQ 0.145±0.055 1.50 (.059 ) 0 ˚~8˚ 0.25(.010) 0.10±0.10 (.004±.004) INDEX Details of "A" part (.020) 0.60±0.15 (.024±.006) "A" 0.50 1 44 88 45 132 89 176 133 (.006±.002) M 0.08(.003) 0.08(.003) (9.26(.365) SQ) C 2013 FUJITSU SEMICONDUCTOR LIMITED HMbF176-18Sc-1-1 0.50±0.20 (.020±.008) (8.06(.317) SQ) (Mounting height) (STAND OFF) +0.20 -0.10 +.008 -.004 Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/ 234 MB91F528_DS705-00016-1v0-E, March 28, 2014 CONFIDENTIAL |
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