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UPD78P324LP датащи(PDF) 69 Page - NEC

номер детали UPD78P324LP
подробное описание детали  16-/8-Bit Single-Chip Microcomputers
PDF  80 Pages
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производитель  NEC [NEC]
домашняя страница  http://www.nec.com/
Logo NEC - NEC

UPD78P324LP датащи(HTML) 69 Page - NEC

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µPD78P324, 78P324(A)
69
9.
RECOMMENDED SOLDERING CONDITIONS
Please solder the package of this product under the conditions recommended as follows.
For details of the recommended conditions for soldering, please refer to the information document
“Semiconductor Device Mounting Technology Manual” (IEI-1207).
For soldering methods and conditions other than those recommended below, please contact NEC sales
personnel.
Table 9-1. Soldering Conditions for Surface-Mount Type (1)
µPD78P324GJ-5BJ
: 74-pin plastic QFP (20 x 20 mm)
µPD78P324LP
: 68-pin plastic QFJ (s
s 950 mil)
µPD78P324LP(A)
: 68-pin plastic QFJ (s
s 950 mil)
µPD78P324LP(A1)
: 68-pin plastic QFJ (s
s 950 mil)
µPD78P324LP(A2)
: 68-pin plastic QFJ (s
s 950 mil)
Soldering Method
Soldering Condition
Infrared reflow
Package peak temperature : 230
°C; time : within 30 secs (210 °C or more);
count: once; day limit : 7 daysNote (hereafter, pre-baked for 36 hrs at 125
°C)
VPS
Package peak temperature : 215
°C; time : within 40 secs (200 °C or more);
count: once; day limit : 7 daysNote (hereafter, pre-baked for 36 hrs at 125
°C)
Wave soldering
Solder bath temperature: no more than 260
°C; time : within 10 secs; count:
once; preheating temperature : 120
°C max. (package surface temperature);
day limit : 7 daysNote (hereafter, pre-baked for 36 hours at 125
°C)
Pin part heating
Pin temperature : no more than 300
°C; time : within 3 secs (per device side)
Recommended
Condition Symbol
IR30-367-1
VP15-367-1
WS60-367-1
Note
Refers to the number of days for storage after the dry pack is opened. The storage conditions are 25
°C
and no more than 65 %RH.
Caution
Avoid using multiple soldering methods at the same time (except the pin part heating method).



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