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PMPB12UN датащи(PDF) 4 Page - NXP Semiconductors |
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PMPB12UN датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 15 page ![]() NXP Semiconductors PMPB12UN 20 V single N-channel Trench MOSFET PMPB12UN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 6 July 2012 4 / 15 017aaa613 1 10-1 10 102 ID (A) 10-2 VDS (V) 10-2 102 10 10-1 1 Limit RDSon = VDS/ID tp = 1 ms tp = 100 µs tp = 10 ms tp = 100 ms DC; Tsp = 25 °C DC; Tamb = 25 °C; drain mounting pad 6 cm2 IDM = single pulse Fig. 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain- source voltage 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit [1] - 235 270 K/W [2] - 67 74 K/W Rth(j-a) thermal resistance from junction to ambient in free air [3] - 33 36 K/W Rth(j-sp) thermal resistance from junction to solder point - 5 10 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2, t ≤ 5 s |
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