AD5232 datasheet(7/24 Pages) AD

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Data Sheet

AD5232

Rev. C | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to GND

−0.3 V, +7 V

VSS to GND

+0.3 V, −7 V

VDD to VSS

7 V

VA, VB, VW to GND

VSS − 0.3 V, VDD + 0.3 V

AX − BX, AX − WX, BX − WX

Intermittent1

±20 mA

Continuous

±2 mA

Digital Inputs and Output Voltage to GND

−0.3 V, VDD + 0.3 V

Operating Temperature Range2

−40°C to +85°C

Maximum Junction Temperature (TJ max)

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature, Soldering

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

Package Power Dissipation

(TJ max − TA)/θJA

Maximum terminal current is bounded by the maximum current handling of

the switches, maximum power dissipation of the package, and maximum

applied voltage across any two of the A, B, and W terminals at a given

resistance.

2 Includes programming of nonvolatile memory.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

16-Lead TSSOP (RU-16)

150

°C/W

ESD CAUTION

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