MPC5604E datasheet(24/75 Pages) FREESCALE

24 / 75 page

MPC5604E Microcontroller Data Sheet, Rev. 4

Electrical characteristics

Freescale Semiconductor

3.5

Thermal characteristics

Table 8. Thermal characteristics for 100-pin LQFP1

1 Thermal characteristics are targets based on simulation that are subject to change per device

characterization.

Symbol

Parameter

Conditions

Typical

value

Unit

RJA

Thermal resistance junction-to-ambient,

natural convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test

board meets JEDEC specification for this package.

Single layer board—1s

°C/W

Four layer board—2s2p

°C/W

RJMA

Thermal resistance junction-to-ambient2

@ 200 ft./min.3, single layer

board—1s

3 Flow rate of forced air flow.

°C/W

@ 200 ft./min.3, four layer

board—2s2p

°C/W

RJB

Thermal resistance junction to board4

4 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—23

°C/W

RJCtop Thermal resistance junction to case (top)

5 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface

layer.

—11

°C/W



Junction to package top natural convection6

6 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal

characterization parameter is written as Psi-JT.

—2

°C/W

Table 9. Thermal characteristics for 64-pin LQFP1

1 Thermal characteristics are targets based on simulation that are subject to change per device

characterization.

Symbol

Parameter

Conditions

Typical

value

Unit

RJA

Thermal resistance junction-to-ambient,

natural convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test

board meets JEDEC specification for this package.

Single layer board—1s

°C/W

Four layer board—2s2p

°C/W

RJMA

Thermal resistance junction-to-ambient2

@ 200 ft./min.3, single layer

board—1s

°C/W

@ 200 ft./min.3, four layer

board—2s2p

°C/W

RJB

Thermal resistance junction to board4

—28

°C/W

RJCtop Thermal resistance junction to case (top)

—14

°C/W



Junction to package top natural convection6

—3

°C/W

MPC5604E датащи(PDF) 24 Page - Freescale Semiconductor, Inc

MPC5604E датащи(HTML) 24 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75

датащи скачать

ссылки URL