DSPIC33FJ64GS406 datasheet(23/456 Pages) MICROCHIP

23 / 456 page

 2009-2012 Microchip Technology Inc.

DS70591E-page 23

dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610

2.0

GUIDELINES FOR GETTING

STARTED WITH 16-BIT

DIGITAL SIGNAL

CONTROLLERS

2.1

Basic Connection Requirements

Getting

started

with

the

dsPIC33FJ32GS406/606/608/610

and

dsPIC33FJ64GS406/606/608/610 family of 16-bit

Digital Signal Controllers (DSC) requires attention

to a minimal set of device pin connections before

proceeding with development. The following is a list

of pin names, which must always be connected:

• All VDD and VSS pins

(see Section 2.2 “Decoupling Capacitors”)

• All AVDD and AVSS pins (regardless if ADC module

is not used)

(see Section 2.2 “Decoupling Capacitors”)

•VCAP

(see Section 2.3 “Capacitor on Internal Voltage

Regulator (VCAP)”)

•MCLR pin

(see Section 2.4 “Master Clear (MCLR) Pin”)

• PGECx/PGEDx pins used for In-Circuit Serial

Programming™ (ICSP™) and debugging purposes

(see Section 2.5 “ICSP Pins”)

• OSC1 and OSC2 pins when external oscillator

source is used

(see Section 2.6 “External Oscillator Pins”)

2.2

Decoupling Capacitors

The use of decoupling capacitors on every pair of

power supply pins, such as VDD, VSS, AVDD, and

AVSS is required.

Consider the following criteria when using decoupling

capacitors:

• Value and type of capacitor: Recommendation of

0.1 µF (100 nF), 10-20V. This capacitor should be a

low-ESR and have resonance frequency in the

range of 20 MHz and higher. It is recommended that

ceramic capacitors be used.

• Placement on the printed circuit board: The

decoupling capacitors should be placed as close to

the pins as possible. It is recommended to place the

capacitors on the same side of the board as the

device. If space is constricted, the capacitor can be

placed on another layer on the PCB using a via;

however, ensure that the trace length from the pin to

the capacitor is within one-quarter inch (6 mm) in

length.

• Handling high-frequency noise: If the board is

experiencing high-frequency noise, upward of tens

of MHz, add a second ceramic-type capacitor in par-

allel to the above described decoupling capacitor.

The value of the second capacitor can be in the

range of 0.01 µF to 0.001 µF. Place this second

capacitor next to the primary decoupling capacitor.

In high-speed circuit designs, consider implement-

ing a decade pair of capacitances as close to the

power and ground pins as possible. For example,

0.1 µF in parallel with 0.001 µF.

• Maximizing performance: On the board layout

from the power supply circuit, run the power and

return traces to the decoupling capacitors first, and

then to the device pins. This ensures that the

decoupling capacitors are first in the power chain.

Equally important is to keep the trace length

between the capacitor and the power pins to a

minimum, thereby reducing PCB track inductance.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32GS406/606/608/610

and

dsPIC33FJ64GS406/606/608/610

family of devices. It is not intended to

be a comprehensive reference source.

To complement the information in

this

data

sheet,

refer

the

“dsPIC33F/PIC24H Family Reference

Manual”. Please see the Microchip web

site (www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

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