AD7416ARMZ datasheet(7/24 Pages) AD

7 / 24 page

AD7416/AD7417/AD7418

Rev. I | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to AGND

−0.3 V to +7 V

VDD to DGND

−0.3 V to +7 V

Analog Input Voltage to AGND

AIN1 to AIN4

−0.3 V to VDD + 0.3 V

Reference Input Voltage to AGND1

−0.3 V to VDD + 0.3 V

Digital Input Voltage to DGND

−0.3 V to VDD + 0.3 V

Digital Output Voltage to DGND

−0.3 V to VDD + 0.3 V

Operating Temperature Range

A Version

−40°C to +125°C

B Version

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

TSSOP, Power Dissipation

450 mW

θJA Thermal Impedance

120°C/W

Lead Temperature, Soldering

260°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

16-Lead SOIC Package, Power Dissipation

450 mW

θJA Thermal Impedance

100°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

8-Lead SOIC Package, Power Dissipation

450 mW

θJA Thermal Impedance

157°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

MSOP Package, Power Dissipation

450 mW

θJA Thermal Impedance

206°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

1 If the reference input voltage is likely to exceed VDD by more than 0.3 V (for

example, during power-up) and the reference is capable of supplying 30 mA

or more, it is recommended to use a clamping diode between the REFIN pin

and the VDD pin. Figure 5 shows how the diode should be connected.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

REFIN

BAT81

AD7417

VDD

Figure 5. Diode Connection

ESD CAUTION

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