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CMS16 датащи(PDF) 3 Page - Toshiba Semiconductor

номер детали CMS16
подробное описание детали  Switching Mode Power Supply Applications Portable Equipment Battery Applications DC-DC Converter Applications
PDF  6 Pages
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

CMS16 датащи(HTML) 3 Page - Toshiba Semiconductor

  CMS16 Datasheet HTML 1Page - Toshiba Semiconductor CMS16 Datasheet HTML 2Page - Toshiba Semiconductor CMS16 Datasheet HTML 3Page - Toshiba Semiconductor CMS16 Datasheet HTML 4Page - Toshiba Semiconductor CMS16 Datasheet HTML 5Page - Toshiba Semiconductor CMS16 Datasheet HTML 6Page - Toshiba Semiconductor  
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CMS16
2010-08-09
3
Handling Precaution
1) Schottky barrier diodes have reverse current characteristics compared to other diodes. SBDs can cause thermal
runaway when used under high temperature or high voltage conditions. Be sure to take forward and reverse
loss into consideration during design.
2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be
exceeded during operation, even for an instant. The following are the general derating methods that we
recommend for designing a circuit incorporating this device.
VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account when designing a device for operation at low
temperature.
IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum
rating of
IF (AV) and that Tj be below 120°C. When using this device, take the margin into consideration by
using an allowable Tamax-IF (AV) curve.
IFSM: This rating specifies the nonrepetitive peak current. This is applied only for abnormal operation,
which seldom occurs during the lifespan of the device.
Tj:
Derate this rating when using the device to ensure high reliability.
We recommend that the device be used at a Tj of below 120°C.
3) Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the
device. When using the device, design the circuit board and soldering land size to match the appropriate
thermal resistance value.
4) Refer to the Rectifiers databook for further information.



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