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CMS16 датащи(PDF) 2 Page - Toshiba Semiconductor |
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CMS16 датащи(HTML) 2 Page - Toshiba Semiconductor |
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2 / 6 page ![]() CMS16 2010-08-09 2 Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit VFM (1) IFM = 1.0 A (pulse test) ⎯ 0.40 ⎯ Peak forward voltage VFM (2) IFM = 3.0 A (pulse test) ⎯ 0.50 0.55 V IRRM (1) VRRM = 5 V (pulse test) ⎯ 2.0 ⎯ Peak repetitive reverse current IRRM (2) VRRM = 40 V (pulse test) ⎯ 26 200 μA Junction capacitance Cj VR = 10 V, f = 1.0 MHz ⎯ 95 ⎯ pF Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.64 mm) ⎯ ⎯ 60 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 6 mm × 6 mm) (board thickness: 1.6 mm) ⎯ ⎯ 135 Thermal resistance (junction to ambient) Rth (j-a) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 mm) ⎯ ⎯ 210 °C/W Thermal resistance (junction to lead) Rth (j-ℓ) ⎯ ⎯ ⎯ 16 °C/W Marking Abbreviation Code Part No. SF CMS16 Land pattern dimensions for reference only 3.0 1.4 Unit: mm 1.4 |
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