CMS16 datasheet(4/6 Pages) TOSHIBA

номер детали	CMS16

подробное описание детали	Switching Mode Power Supply Applications Portable Equipment Battery Applications DC-DC Converter Applications

PDF	6 Pages

Scroll/Zoom	100%

производитель	TOSHIBA [Toshiba Semiconductor]

домашняя страница	http://www.semicon.toshiba.co.jp/eng

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4 / 6 page

CMS16

2010-08-09

Tj = 150°C

25°C

75°C

125°C

Instantaneous forward voltage vF

(V)

iF – vF

100

0.6

0.2

0.4

1.6

1.2

0.8

1.0

1.4

0.1

0.3

Pulse test

Time t (s)

rth (j-a) – t

1000

100

0.001

1000

0.01

0.1

100

Device mounted on a glass-epoxy board:

board size: 50 mm

× 50 mm

Soldering land: 2.1 mm

× 1.4 mm

board thickness: 1.6 mm

Device mounted on a glass-epoxy board:

board size: 50 mm

× 50 mm

Soldering land: 6.0 mm

× 6.0 mm

board thickness: 1.6 mm

Device mounted on a ceramic board:

board size: 50 mm

× 50 mm

Soldering land: 2.0 mm

× 2.0 mm

board thickness: 0.64 mm

300

500

0.003

0.03

0.3

300

α = 60°

180°

120°

Average forward current IF (AV) (A)

PF (AV) – IF (AV)

0.4

2.6

0.8 1.2

2.0

4.4

0.8

1.8

0.4

1.6

1.2

2.2

2.4 2.8

360°

0°

Rectangular

waveform

Conduction angle

3.2 3.6 4.0

0.2

0.6

1.0

1.4

1.6

2.4

2.0

α = 60°

180°

120°

Average forward current IF (AV) (A)

Tℓ max – IF (AV)

160

120

100

140

360°

0°

VR = 20 V

IF (AV)

Conduction

angle

Rectangular

waveform

0.4

1.2 1.6

3.2

3.6

2.8

4.0 4.4

2.4

2.0

0.8

180°

120°

α = 60°

Average forward current IF (AV) (A)

Ta max – IF (AV)

160

120

100

140

Device mounted on a ceramic board:

board size: 50 mm

× 50 mm

soldering land:

2 mm

× 2 mm

board thickness:

0.64 mm

360°

0°

VR = 20 V

IF (AV)

Conduction

angle

Rectangular

waveform

0.4

0.8 1.2

2.0

2.4

1.6

2.8

4.4

3.2

3.6 4.0

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