SC5010 datasheet(23/36 Pages) SEMTECH

23 / 36 page

SC5010

Applications Information (continued)

Vin

(5-27V)

S C 5010

VCC

UVLO

SCP

FSET

AGND

9 10 11 12 13 14

IO8

IO7 16

IO6 17

IO5

IO4 19

IO3 20

IO2 21

THP

SDA

R15

10nF

SCL

PWMI

R10

Vcc (5V)

AGND

R11

SYNC

Vout

PAD

FLT

2.2μF

10K



PGND

4.7μF

1μF

30K



0.1



20K



10K



100k



Vcc (5V)

Figure 4 — Cascode Configuration (for high output voltage application)

for R9 and C6 should be PGND. These components

should be close to the SC5010.

Resistor (R8) is the output current adjusting resistor

for IO1 through IO8 and should return to AGND. Place

it next to the IC.

Resistor (R6) is the switching frequency adjusting

resistor and should return to AGND. Place it next to

the IC.

The decoupling capacitor (C3) for Pin BG should return

to AGND. Place it next to the IC.

Resistors (R4, R5) form a divider to set the SCP level, R4

should return to AGND. Place it next to the IC.

Resistors (R2, R1) form a divider to set the UVLO level

for V

. R1 should return to AGND. Place it next to the

IC.

R11 and R10 form a divider to set the OVP level for

10.

VOUT, R10 should return to AGND. Place it next to the

IC.

All the traces for components with AGND connection

should avoid being routed close to the noisy areas.

An exposed pad is located at the bottom of the SC5010

for heat dissipation. A copper area underneath the

pad is used for better heat dissipation. On the bottom

layer of the PCB another copper area, connected

through vias to the top layer, is used for better

thermal performance. The pad at the bottom of the

SC5010 should be connected to AGND. AGND should

be connected to PGND at single point for better noise

immunity.

11.

12.

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