MPC5125 datasheet(41/94 Pages) FREESCALE

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Electrical and Thermal Characteristics

MPC5125 Microcontroller Data Sheet, Rev. 4

Freescale Semiconductor

4.1.4

Electrostatic Discharge

CAUTION

This device contains circuitry that protects against damage due to high-static voltage or

electrical fields. However, it is advised that normal precautions be taken to avoid

application of any voltages higher than maximum-rated voltages. Operational

reliability is enhanced if unused inputs are tied to an appropriate logic voltage level (GND

or VDD). Table 11 gives package thermal characteristics for this device.

Table 7. General I/O Pads1 — Drive Current, Slew Rate

NOTES:

1 General I/O—rise and fall times at drive load 50 pF.

Pad Type

Supply Voltage

Drive Select/Slew

Rate Control

Rise time

max (ns)

Fall time

max (ns)

Current

Ioh (mA)

Current

Iol (mA)

SpecID

General IO

VDD_IO = 3.3 V

Configuration 3 (11)

1.4

1.6

D3.41

Configuration 2 (10)

9.8

D3.42

Configuration 1 (01)

D3.43

Configuration 0 (00)

140

183

D3.44

Table 8. DDR I/O Pads1 — Drive Current, Slew Rate

NOTES:

1 DDR—rise and fall times at 50

 transmission line impedance terminated to MV

TT (0.5 VDD_IO_MEM) + 4 pF load.

Pad Type

Supply Voltage

Drive Select/

Slew Rate Control

Rising slew

max (ns)2

2 Rising slew rate measured between 0.5 × V

DD_IO_MEM – 450 mV and 0.5 × VDD_IO_MEM + 50 mV for all modes.

Falling slew

max (ns)3

3 Falling slew rate measured between 0.5 × V

DD_IO_MEM + 50 mV and 0.5 × VDD_IO_MEM – 450 mV for all modes.

Current

Ioh (mA)

Current

Iol (mA)

SpecID

DDR

VDD_IO_MEM = 2.5 V (DDR) Configuration 3 (011)

0.45

16.2

D3.45

VDD_IO_MEM = 1.8 V (LPDDR

and SDR)

Configuration 0 (000)

0.8

4.6

D3.46

Configuration 1 (001)

8.1

D3.47

VDD_IO_MEM = 1.8 V (DDR2) Configuration 2 (010)

0.7

5.3

D3.48

Configuration 6 (110)

13.4

D3.49

VDD_IO_MEM = 3.3 V (SDR) Configuration 7 (111)

0.45

D3.50

Table 9. ESD and Latch-Up Protection Characteristics

Sym

Rating

Min

Max

Unit

SpecID

VHBM

Human body model (HBM) — JEDEC JESD22-A114-B

2000

—

D4.1

VMM

Machine model (MM) — JEDEC JESD22-A115

200

—

D4.2

VCDM

Charge device model (CDM) — JEDEC JESD22-C101

250

—

D4.3

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