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HT16C21 датащи(PDF) 33 Page - Holtek Semiconductor Inc |
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HT16C21 датащи(HTML) 33 Page - Holtek Semiconductor Inc |
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33 / 34 page ![]() Rev. 1.00 33 November 22, 2011 HT16C21 SOP 28W (300mil) Symbol Description Dimensions in mm W Carrier Tape Width 24.0±0.3 P Cavity Pitch 12.0±0.1 E Perforation Position 1.75±0.10 F Cavity to Perforation (Width Direction) 11.5±0.1 D Perforation Diameter 1.5+0.1/-0.0 D1 Cavity Hole Diameter 1.50+0.25/-0.00 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 10.85±0.10 B0 Cavity Width 18.34±0.10 K0 Cavity Depth 2.97±0.10 t Carrier Tape Thickness 0.35±0.01 C Cover Tape Width 21.3±0.1 16-pin NSOP (150mil) Symbol Description Dimensions in mm W Carrier Tape Width 16.0±0.3 P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.10 F Cavity to Perforation (Width Direction) 7.5±0.1 D Perforation Diameter 1.55+0.1/-0.0 D1 Cavity Hole Diameter 1.50+0.25/-0.00 P0 Perforation Pitch 4.0±0.10 P1 Cavity to Perforation (Length Direction) 2.0±0.10 A0 Cavity Length 6.5±0.10 B0 Cavity Width 10.3±0.10 K0 Cavity Depth 2.1±0.10 t Carrier Tape Thickness 0.30±0.05 C Cover Tape Width 13.3±0.1 |
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