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HT16C21 датащи(PDF) 32 Page - Holtek Semiconductor Inc

номер детали HT16C21
подробное описание детали  RAM Mapping 20*4 / 16*8 LCD Driver Controller
PDF  34 Pages
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производитель  HOLTEK [Holtek Semiconductor Inc]
домашняя страница  http://www.holtek.com
Logo HOLTEK - Holtek Semiconductor Inc

HT16C21 датащи(HTML) 32 Page - Holtek Semiconductor Inc

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Rev. 1.00
32
November 22, 2011
HT16C21
Carrier Tape Dimensions
Carrier Tape Dimensions
SOP 28W (300mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
24.0±0.3
P
Cavity Pitch
12.0±0.1
E
Perforation Position
1.75±0.10
F
Cavity to Perforation (Width Direction)
11.5±0.1
D
Perforation Diameter
1.5
+0.1/-0.0
D1
Cavity Hole Diameter
1.50
+0.25/-0.00
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
10.85±0.10
B0
Cavity Width
18.34±0.10
K0
Cavity Depth
2.97±0.10
t
Carrier Tape Thickness
0.35±0.01
C
Cover Tape Width
21.3±0.1
Package Information
3
April 1, 2010
P
D
1
W
P
1
P
0
D
E
F
t
K
0
B
0
A
0
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SOP 20W (300mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
24.0+0.3/-0.1
P
Cavity Pitch
12.0±0.1
E
Perforation Position
1.75±0.10
F
Cavity to Perforation (Width Direction)
11.5±0.1
D
Perforation Diameter
1.5+0.1/-0.0
D1
Cavity Hole Diameter
1.50+0.25/-0.00
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
10.8±0.1
B0
Cavity Width
13.3±0.1
K0
Cavity Depth
3.2±0.1
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
21.3±0.1
SOP 24W (300mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
24.0+0.3
P
Cavity Pitch
12.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
11.5±0.1
D
Perforation Diameter
1.55+0.1/-0.00
D1
Cavity Hole Diameter
1.50+0.25/-0.00
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
10.9±0.1
B0
Cavity Width
15.9±0.1
K0
Cavity Depth
3.1±0.1
t
Carrier Tape Thickness
0.35±0.05
C
Cover Tape Width
21.3±0.1



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