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MSC8156 датащи(PDF) 63 Page - Freescale Semiconductor, Inc |
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MSC8156 датащи(HTML) 63 Page - Freescale Semiconductor, Inc |
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63 / 68 page ![]() Ordering Information MSC8156 Six-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor 63 3.6 Guide to Selecting Connections for Remote Power Supply Sensing To assure consistency of input power levels, some applications use a practice of connecting the remote sense signal input of an on-board power supply to one of power supply pins of the IC device. The advantage of using this connection is the ability to compensate for the slow components of the IR drop caused by resistive supply current path from on-board power supply to the pins layer on the package. However, because of specific device requirements, not every ball connection can be selected as the remote sense pin. Some of these pins must be connected to the appropriate power supply or ground to ensure correct device functionality. Some connections supply critical power to a specific high usage area of the IC die; using such a connection as a non-supply pin could impact necessary supply current during high current events. The following balls can be used as the board supply remote sense output without degrading the power and ground supply quality: • VDD: W10, T19 • VSS: J18, Y10 • M3VDD: None Do not use any other connections for remote sensing. Use of any other connections for this purpose can result in application and device failure. 4 Ordering Information Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order. Part Package Type Spheres Core Voltage Operating Temperature Core Frequency (MHz) Order Number MSC8156 Flip Chip Plastic Ball Grid Array (FC-PBGA) Lead-free 1.0 V 0° C to 105°C 1000 MSC8156SVT1000B –40° to 105°C 1000 MSC8156TVT1000B |
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