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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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360J датащи(PDF) 35 Page - Intel Corporation |
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360J датащи(HTML) 35 Page - Intel Corporation |
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35 / 68 page  Datasheet 35 Package Mechanical Specifications and Pin Information NOTES: 1. Overall height as delivered. Values are based on design specifications and tolerances. This dimension is subject to change based on OEM motherboard design or OEM SMT process Table 13. Micro-FCPGA Package Dimensions Symbol Parameter Min Max Unit A Overall height, as delivered (Refer to Note 1) 2.60 2.85 mm A2 Die height 0.82 mm b Ball diameter 0.78 mm D Package substrate length 34.9 35.1 mm E Package substrate width 34.9 35.1 mm D1 Die length 12.54 mm E1 Die width 6.99 mm eBall pitch 1.27 mm K Package edge keep-out 5 mm K1 Package corner keep-out 7 mm K2 Die-side capacitor height – 0.7 mm S Package edge to first ball center 1.625 mm N Ball count 479 each – Solder ball coplanarity 0.2 mm Pdie Allowable pressure on the die for thermal solution – 689 kPa WPackage weight 4.5 g |
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