PCA2000_2001

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 08 — 23 August 2010

26 of 30

NXP Semiconductors

PCA2000; PCA2001

32 kHz watch circuit with programmable adaptive motor pulse

Device removal can be done when the substrate is heated until it is certain that all solder

joints are molten. The chip can then be carefully removed from the substrate without

damaging the tracks and solder lands on the substrate. Removing the device must be

done using plastic tweezers, because metal tweezers can damage the silicon. The

surface of the substrate should be carefully cleaned and all solder and flux residues

and/or underfill removed. When a new chip is placed on the substrate, use the flux

process instead of solder on the solder lands. Apply flux on the bumps at the chip side as

well as on the solder pads on the substrate. Place and align the new chip while viewing

with a microscope. To reflow the solder, use the solder profile shown in application note

AN10365 “Surface mount reflow soldering description”.

13.3.4 Cleaning

Cleaning can be done after reflow soldering.

14. Abbreviations

15. References

[1]

AN10706 — Handling bare die

[2]

IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[3]

IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[4]

JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[5]

JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model

(MM)

[6]

JESD78 — IC Latch-Up Test

[7]

JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[8]

NX3-00092 — NXP store and transport requirements

Table 16.

Abbreviations

Acronym

Description

HBM

Human Body Model

LSB

Least Significant Bit

MM

Machine Model

MSB

Most Significant Bit

OTP

One Time Programmable