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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SC68C652B датащи(PDF) 39 Page - NXP Semiconductors |
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SC68C652B датащи(HTML) 39 Page - NXP Semiconductors |
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39 / 43 page  SC68C652B_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 2 November 2009 39 of 43 NXP Semiconductors SC68C652B Dual UART with 32-byte FIFOs and IrDA encoder/decoder 12.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 18) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 30 and 31 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 18. Table 30. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature ( °C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 31. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature ( °C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 |
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