AD9575

Rev. 0 | Page 7 of 16

ABSOLUTE MAXIMUM RATINGS

Table 9.

Parameter

Rating

VDD, VDDA, VDDX, VDD_CMOS to GND

−0.3 V to +3.6 V

XO1, XO2 to GND

LVDS/LVPECL OUT, LVDS/LVPECL OUT,

CMOS OUT/SEL1 to GND

Junction Temperature1

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 10. Thermal Resistance1

Package Type

Unit

16-Lead TSSOP

90.3

°C/W

in accordance with EIA/JESD51-7.

ESD CAUTION