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LPC2364 датащи(PDF) 4 Page - NXP Semiconductors |
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LPC2364 датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 59 page ![]() xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 4.1 Ordering options Table 2. Ordering options Type number Flash (kB) SRAM (kB) Ethernet USB device + 4 kB FIFO SD/MMC GP DMA Channels Temp range Local bus Ethernet buffers GP/USB RTC Total CAN ADC DAC LPC2364FBD100 128 8 16 8 2 34 RMII yes no yes 2 6 1 −40 °C to +85 °C LPC2364HBD100 128 8 16 8 2 34 RMII yes no yes 2 6 1 −40 °C to +125 °C LPC2364FET100 128 8 16 8 2 34 RMII yes no yes 2 6 1 −40 °C to +85 °C LPC2365FBD100 256 32 16 8 2 58 RMII no no yes - 6 1 −40 °C to +85 °C LPC2366FBD100 256 32 16 8 2 58 RMII yes no yes 2 6 1 −40 °C to +85 °C LPC2367FBD100 512 32 16 8 2 58 RMII no yes yes - 6 1 −40 °C to +85 °C LPC2368FBD100 512 32 16 8 2 58 RMII yes yes yes 2 6 1 −40 °C to +85 °C LPC2368FET100 512 32 16 8 2 58 RMII yes yes yes 2 6 1 −40 °C to +85 °C |
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