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LPC2364 датащи(PDF) 3 Page - NXP Semiconductors

номер детали LPC2364
подробное описание детали  Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
PDF  59 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC2364 датащи(HTML) 3 Page - NXP Semiconductors

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LPC2364_65_66_67_68_6
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 06 — 1 February 2010
3 of 59
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
On-chip PLL allows CPU operation up to the maximum CPU rate without the need for
a high frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the RTC oscillator.
Boundary scan for simplified board testing is available in LPC2364FET100 and
LPC2368FET100 (TFBGA package).
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
3.
Applications
Industrial control
Medical systems
Protocol converter
Communications
4.
Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC2364FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14
× 14 × 1.4 mm
SOT407-1
LPC2364HBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14
× 14 × 1.4 mm
SOT407-1
LPC2364FET100
TFBGA100
plastic thin fine-pitch ball grid array package; 100 balls; body 9
× 9 × 0.7 mm SOT926-1
LPC2365FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14
× 14 × 1.4 mm
SOT407-1
LPC2366FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14
× 14 × 1.4 mm
SOT407-1
LPC2367FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14
× 14 × 1.4 mm
SOT407-1
LPC2368FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14
× 14 × 1.4 mm
SOT407-1
LPC2368FET100
TFBGA100
plastic thin fine-pitch ball grid array package; 100 balls; body 9
× 9 × 0.7 mm SOT926-1



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