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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8548E датащи(PDF) 88 Page - Freescale Semiconductor, Inc |
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MPC8548E датащи(HTML) 88 Page - Freescale Semiconductor, Inc |
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88 / 144 page  MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 88 Freescale Semiconductor Package Description 18.2 Mechanical Dimensions of the HiCTE FC-CBGA and FC-PBGA with Full Lid Figure 55 shows the mechanical dimensions and bottom surface nomenclature for both the MPC8548E HiCTE FC-CBGA and FC-PBGA package with full lid. Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature of the HiCTE FC-CBGA and FC-PBGA with Full Lid Notes: 1. All d imensions are in millimeters. 2. Dimensioning and tolerancing per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 6. All dimensions are symmetric across the package center lines unless dimensioned otherwise. 7. Package code summary: •PBGA 8423 •CBGA 5112 |
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