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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8548E датащи(PDF) 87 Page - Freescale Semiconductor, Inc |
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MPC8548E датащи(HTML) 87 Page - Freescale Semiconductor, Inc |
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87 / 144 page  MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 87 Package Description 18 Package Description This section details package parameters, pin assignments, and dimensions. 18.1 Package Parameters The package parameters for both the HiCTE FC-CBGA and FC-PBGA are as provided in Table 66. Table 66. Package Parameters Parameter CBGA1 PBGA2 Package outline 29 mm × 29 mm 29 mm × 29 mm Interconnects 783 783 Ball pitch 1 mm 1 mm Ball diameter (typical) 0.6 mm 0.6 mm Solder ball 62% Sn 36% Pb 2% Ag 62% Sn 36% Pb 2% Ag Solder ball (lead-free) 95% Sn 4.5% Ag 0.5% Cu 96.5% Sn 3.5% Ag Notes: 1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device. 2. The FC-PBGA package is available on only Version 2.1.1 and 2.1.2 of the device. |
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