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IMX35 датащи(PDF) 1 Page - Freescale Semiconductor, Inc

номер детали IMX35
подробное описание детали  i.MX35 Applications Processors for Automotive Products
PDF  148 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

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Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MCIMX35SR2AEC
Rev. 6, 10/2009
© Freescale Semiconductor, Inc., 2008, 2009. All rights reserved.
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
IMX35
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1
Introduction
The i.MX35 Auto Application Processor family is
designed for automotive infotainment and
navigation applications. These processors are
AECQ100 Grade 3 qualified and rated for ambient
operating temperatures up to 85
°C.
The i.MX35 multimedia applications processor
represents the next step in low-power,
high-performance application processors.
Based on an ARM11 microprocessor core running
at up to 532 MHz, the device offers the following
features and optimized system cost for the target
applications.
Audio connectivity and telematics:
— Compressed audio playback from
storage devices (CD, USB, HDD or SD
card)
— PlayFromDevice (1-wire and 2-wire
support) for portable media players
i.MX35 Applications
Processors for
Automotive Products
Silicon Revisions 2.0 and 2.1
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Functional Description and Application Information . . . . . 5
2.1
Application Processor Domain Overview. . . . . . . . . 5
2.2
Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3
Advanced Power Management Overview . . . . . . . . 6
2.4
ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 6
2.5
Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Signal Descriptions: Special Function Related Pins . . . . 12
4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1
i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 13
4.2
Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3
Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4
Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 19
4.6
Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 20
4.7
I/O Pin DC Electrical Characteristics . . . . . . . . . . . 22
4.8
I/O Pin AC Electrical Characteristics . . . . . . . . . . . 25
4.9
Module-Level AC Electrical Specifications. . . . . . . 31
5
Package Information and Pinout . . . . . . . . . . . . . . . . . . 132
5.1
MAPBGA Production Package 1568-01, 17
× 17 mm,
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
5.2
MAPBGA Signal Assignments. . . . . . . . . . . . . . . 134
6
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . 147
7
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147


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