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IMX35 датащи(PDF) 23 Page - Freescale Semiconductor, Inc

номер детали IMX35
подробное описание детали  i.MX35 Applications Processors for Automotive Products
PDF  148 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
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IMX35 датащи(HTML) 23 Page - Freescale Semiconductor, Inc

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i.MX35 Applications Processors for Automotive Products, Rev. 6
Freescale Semiconductor
23
4.7
I/O Pin DC Electrical Characteristics
I/O pins are of two types: GPIO and DDR. DDR pins can be configured in three different drive strength
modes: mobile DDR, SDRAM, and DDR2. The SDRAM and mobile DDR modes can be further
customized at three drive strength levels: normal, high, and max.
Table 13 shows currents for the different DDR pin drive strength modes.
Junction to case (top)3
—ReJCtop
10
ºC/W
Junction to package top4
Natural convection
ΨJT
2ºC/W
1 Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
2 Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for this
package.
3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer.
4 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
Table 13. DDR Pin Drive Strength Mode Current Levels
Drive Mode
Normal
High
Max.
Mobile DDR (1.8 V)
3.6 mA
7.2 mA
10.8 mA
SDRAM (1.8 V)
—
—
6.5 mA
SDRAM (3.3 V)
4 mA
8 mA
12 mA
DDR2 (1.8 V)
—
—
13.4 mA
Table 12. Thermal Resistance Data (continued)
Rating
Condition
Symbol
Value
Unit



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