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STM32F101C6U6ATR датащи(PDF) 30 Page - STMicroelectronics

номер детали STM32F101C6U6ATR
подробное описание детали  Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
PDF  73 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32F101C6U6ATR датащи(HTML) 30 Page - STMicroelectronics

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Electrical characteristics
STM32F101x4, STM32F101x6
30/74
Doc ID 15058 Rev 3
5.3.2
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 9.
Operating conditions at power-up / power-down
5.3.3
Embedded reset and power control block characteristics
The parameters given in Table 10 are derived from tests performed under the ambient
temperature and VDD supply voltage conditions summarized in Table 8.
PD
Power dissipation at TA =
85 °C(3)
LQFP64
444
mW
LQFP48
363
VFQFPN36
1110
TA
Ambient temperature
Maximum power dissipation
–40
85
°C
Low power dissipation(4)
–40
105
°C
TJ
Junction temperature range
–40
105
°C
1.
When the ADC is used, refer to Table 41: ADC characteristics.
2.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
3.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
characteristics on page 69).
4.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.2: Thermal characteristics on page 69).
Table 8.
General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
0
µs/V
VDD fall time rate
20



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