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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST7261 датащи(PDF) 61 Page - STMicroelectronics |
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ST7261 датащи(HTML) 61 Page - STMicroelectronics |
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61 / 80 page  ST7261 61/80 EMC CHARACTERISTICS (Cont’d) True Open Drain Pin Protection The centralized protection (4) is not involved in the discharge of the ESD stresses applied to true open drain pads due to the fact that a P-Buffer and diode to VDD are not implemented. An additional local protection between the pad and VSS (5a & 5b) is implemented to completely absorb the posi- tive ESD discharge. Multisupply Configuration When several types of ground (VSS, VSSA, ...) and power supply (VDD, VDDA, ...) are available for any reason (better noise immunity...), the structure shown in Figure 42 is implemented to protect the device against ESD. Figure 40. Positive Stress on a True Open Drain Pad vs. VSS Figure 41. Negative Stress on a True Open Drain Pad vs. VDD Figure 42. Multisupply Configuration IN VDD VSS (1) (2b) (4) OUT VDD VSS (3b) Main path Path to avoid (5a) (5b) IN VDD VSS (1) (2b) (4) OUT VDD VSS (3b) Main path (3b) (3b) VDDA VSSA VDDA VDD VSS BACK TO BACK DIODE BETWEEN GROUNDS VSSA |
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