1. General description

The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the

MIFARE card IC coil design guide and is qualified to work properly in NXP reader

environment, which is built according to NXP specification.

This specification describes electrical, physical and dimensional properties of wafers.

2. Ordering information

3. Mechanical specification

3.1 Wafer

8”

150

µm ± 15 µm

15601

reticle area

3.2 Wafer backside

Si

ground and stress relieve

3.3 Chip dimensions

1.42 x 1.34 mm

x-line: 86.4

µm

y-line: 86.4

µm

MF1 IC S70 01

Standard 4Kbyte card IC sawn wafer on UV-tape addendum

Rev. 3.1 — 18 April 2007

Product data sheet

101731

PUBLIC

Table 1.

Ordering information

Type number

Package

Name

Description

Ordering Code

MF1ICS7001W/V9D

Die on sawn wafer

9352 774 53005