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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MF1ICS7001 датащи(PDF) 4 Page - NXP Semiconductors |
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MF1ICS7001 датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 7 page  101731 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 3.1 — 18 April 2007 4 of 7 NXP Semiconductors MF1 IC S70 01 Standard 4Kbyte card IC 6. Chip orientation and bond pad locations Fig 1. Chip orientation and bond pad locations PAD location 1 x[µm] y[ µm] VSS( 108 x 108) 2 -1.1 1091.9 TESTIO( 95 x 110) 0.0 0.0 LA(118 x118) 223.4 1.7 LB( 118 x118) 1160..9 1081.9 1) Reference point : Lower left corner of pad . 2) Pad size in µm (1 ) x - Scribeline width 86. 4 µm (5 ) LA pad edge to chip edgey -length 28. 6µm (2 ) y - Scribeline width 86. 4 µm (6 ) LA pad edge to chip edge - length 251. 8µm (3 ) Chip step,x- length . 42 mm 26. 8µm (4 ) Chip step,y- length 1. 34mm 26. 2µm (5) TESTIO (1) X Y (4) (3) (2) LA (6) VSS (7) (8) LB Widths and lengths are measured from metal to metal ( top layer). (7 ) LB pad edge to chip edgey - length (8 ) LB pad edge to chip edgex - length 1 x |
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