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TS3USB221EDRCR.B датащи(PDF) 14 Page - Texas Instruments

номер детали TS3USB221EDRCR.B
подробное описание детали  TS3USB221E High-Speed USB 2.0 (480Mbps) 1:2 MultiplexerDemultiplexer Switch With Single Enable and IEC Level 3 ESD Protection
PDF  29 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

TS3USB221EDRCR.B датащи(HTML) 14 Page - Texas Instruments

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7.2.3 Application Curves
Time ( 10 ) (s)
X
–9
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Figure 7-2. Eye Pattern: 480-Mbps USB Signal With
No Switch (Through Path)
Time ( 10 ) (s)
X
–9
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Figure 7-3. Eye Pattern: 480-Mbps USB Signal With
Switch 1D Path
Time ( 10 ) (s)
X
–9
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Figure 7-4. Eye Pattern: 480-Mbps USB Signal With Switch 2D Path
7.3 Power Supply Recommendations
Make sure that the power to the device supplied through the VCC pin follows the USB 1.0, 1.1, and 2.0
standards. TI recommends placing a bypass capacitor as close as possible to the supply pin VCC to help smooth
out lower frequency noise to provide better load regulation across the frequency spectrum.
7.4 Layout
7.4.1 Layout Guidelines
Place supply bypass capacitors as close to VCC pin as possible and avoid placing the bypass caps near the
D+/D– traces.
The high speed D+/D– traces should always be matched lengths and must be no more than 4 inches; otherwise,
the eye diagram performance can be degraded. A high-speed USB connection is made through a shielded,
twisted pair cable with a differential characteristic impedance. In layout, the impedance of D+ and D– traces
should match the cable characteristic differential impedance for optimal performance.
Route the high-speed USB signals using a minimum of vias and corners to reduce signal reflections and
impedance changes. When a via must be used, increase the clearance size around the via to minimize the
capacitance. Each via introduces discontinuities in the transmission line of the signal and increases the chance
of picking up interference from the other layers of the board. Be careful when designing test points on twisted
pair lines; through-hole pins are not recommended.
When it becomes necessary to turn 90°, use two 45° turns or an arc instead of making a single 90° turn. This
reduces reflections on the signal traces by minimizing impedance discontinuities.
Do not route USB traces under or near crystals, oscillators, clock signal generators, switching regulators,
mounting holes, magnetic devices or ICs that use or duplicate clock signals.
TS3USB221E
SCDS263E – SEPTEMBER 2009 – REVISED JULY 2024
www.ti.com
14
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Product Folder Links: TS3USB221E



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