TLV9302IDDFR datasheet(6/61 Pages) TI2

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6.5 Thermal Information for Dual Channel

THERMAL METRIC(1)

TLV9302

UNIT

D (SOIC)

DDF (SOT-23-8)

DGK (VSSOP)

PW (TSSOP)

8 PINS

RθJA

Junction-to-ambient thermal

resistance

138.7

150.4

189.3

188.4

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

78.7

85.6

75.8

77.1

°C/W

RθJB

Junction-to-board thermal resistance

82.2

70.0

111.0

119.1

°C/W

ψJT

Junction-to-top characterization

parameter

27.8

8.1

15.4

14.2

°C/W

ψJB

Junction-to-board characterization

parameter

81.4

69.6

109.3

117.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.6 Thermal Information for Quad Channel

THERMAL METRIC(1)

TLV9304

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

105.5

134.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

61.4

55.4

°C/W

RθJB

Junction-to-board thermal resistance

61.0

79.2

°C/W

ψJT

Junction-to-top characterization parameter

21.6

9.3

°C/W

ψJB

Junction-to-board characterization parameter

60.3

78.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TLV9301, TLV9302, TLV9304

SBOS941D – FEBRUARY 2019 – REVISED AUGUST 2021

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