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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TLV9302IDDFR датащи(PDF) 55 Page - Texas Instruments |
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TLV9302IDDFR датащи(HTML) 55 Page - Texas Instruments |
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55 / 61 page  www.ti.com PACKAGE OUTLINE C 12X 0.65 2X 3.9 14X 0.30 0.17 6.6 6.2 TYP 1.2 MAX 0.15 0.05 0.25 GAGE PLANE 0 -8 4X (0 -12 ) B 4.5 4.3 NOTE 4 A 5.1 4.9 NOTE 3 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max height PW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023 1 7 8 14 0.1 C A B PIN 1 INDEX AREA SEE DETAIL A 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500 |
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