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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SLAS455D датащи(PDF) 64 Page - Texas Instruments |
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SLAS455D датащи(HTML) 64 Page - Texas Instruments |
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64 / 67 page  NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. PACKAGE OUTLINE 4219044/D 02/2022 www.ti.com VQFN - 1 mm max height PLASTIC QUADFLAT PACK- NO LEAD RGZ0048A A 0.08 C 0.1 C A B 0.05 C B SYMM SYMM PIN 1 INDEX AREA 7.1 6.9 7.1 6.9 1 MAX 0.05 0.00 SEATING PLANE C 5.15±0.1 2X 5.5 2X 5.5 44X 0.5 48X 0.5 0.3 48X 0.30 0.18 PIN1 ID (OPTIONAL) (0.2) TYP 1 12 13 24 25 36 37 48 (0.1) TYP SIDE WALL DETAIL OPTIONAL METAL THICKNESS SEE SIDE WALL DETAIL CHAMFERED LEAD CORNER LEAD OPTION (0.45) TYP SEE LEAD OPTION |
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