LP5523 datasheet(4/61 Pages) TI2

4 / 61 page

LP5523

SNVS550E – SEPTEMBER 2009 – REVISED JANUARY 2017

www.ti.com

Product Folder Links: LP5523

Submit Documentation Feedback

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.

(3)

All voltages are with respect to the potential at the GND pin.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VDD

–0.3

Voltage on D1 to D9, C1

−, C1+, C2–, C+, VOUT

–0.3

VDD + 0.3 V with 6 V maximum

Continuous power dissipation

Internally limited

Junction temperature, TJ-MAX

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per

ANSI/ESDA/JEDEC JS-001(1)

All pins except D1 to D9

±2500

Pins D1 to D9

±8000

Charged-device model (CDM), per JEDEC

specification JESD22-C101(2)

All pins

±1000

Machine model

All pins

250

(1)

All voltages are with respect to the potential at the GND pin.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VDD input voltage

2.7

5.5

Voltage on logic pins (input or output pins)

VDD

Recommended charge pump load current

100

Junction temperature, TJ

–30

125

°C

Ambient temperature, TA

(2)

–30

°C

LP5523 датащи(PDF) 4 Page - Texas Instruments

LP5523 датащи(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61

датащи скачать

ссылки URL