FXLS8971CF datasheet(93/100 Pages) NXP

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NXP Semiconductors

FXLS8971CF

3-Axis Low-g Accelerometer

Document ID

Release date

Description

landing pattern on a 2-layer FR4 PCB with 1.2 mm (47 mil) overall

thickness." to "Determined with post board mount data using a standard

lead-free reflow profile and NXP recommended landing pattern on a 10-

layer FR4 PCB with 1.6 mm (63 mil) overall thickness."

– Footnote 2: revised footnote from "Based on characterization data on

limited number of parts from 3 lots" to "Based on characterization data on

limited number of parts from 3 lots. Limits provided with 4 sigma margin

and 99% confidence level."

– Section 9.1, inserted new section, content and images.

• Section 10, Table 8, revsied as follows:

– IDDHPM: revsied the Typ value from "150" to "146.9".

– IDDLPM: revised all Typ values from "150, 75, 38, 20, 11, 5.3, 3.1, 1.8, 1.4,

1.0, 0.80, 0.70, and 0.65." to "146.9, 73.9, 37.5, 19.4, 10.4, 5.04, 2.75, 1.6,

1.21, 0.84, 0.65, 0.56, and 0.51".

– IDDSTBY: revised Typ value from "0.60" to "0.46".

• Section 15.3.3, Table 52 and Table 53, removed the columns titled "Noise RMS

(mg)" and "IDD (µA)" and the associated footnotes.

• Section 16.3, Figure 22, Figure 23, Figure 25, Figure 26, and Figure 27,

updated the graphic registration number, no content change to the images.

• Section 16.3, Figure 24, revised "C2 0.1 µF" to "C1 0.1 µF" and updated the

graphic registration number.

• Section 19.1, inserted note at the end of the section.

• Section 20, Cross-axis sensitivity: Removed "The cross-axis sensitivity

specification represents the maximum of these six terms." from the description.

FXLS8971CF v.1.1 20 December 2022

• FXLS8971CF v.1.1 supercedes FXLS8971CF v.1.

• FXLS8971CF v.1.1 is an objective data sheet.

• Section 2, Post-board mount feature, revised "±0.25 mg/°C (typ)" to "–0.15 mg/

°C (typ)."

FXLS8971CF v.1

28 November 2022

• FXLS8971CF v.1 is an objective data sheet.

• Initial release.

Table 122. Revision history...continued

FXLS8971CF

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2.1 — 7 March 2024

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