TMUX1574DYYR datasheet(26/44 Pages) TI

26 / 44 page

Supply Voltage (V)

1.5

2.5

3.5

4.5

5.5

100

Propagation Delay - PW

Skew - PW

Propagation Delay - RSV

Skew - RSV

Propagation Delay - DYY

Skew - DYY

D020

TMUX1574

SCDS391C – OCTOBER 2018 – REVISED DECEMBER 2019

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9.2.2 Detailed Design Procedure

The TMUX1574 can be operated without any external components except for the supply decoupling capacitors.

The TMUX1574 has internal weak pull-down resistors (6 MΩ) to GND so that it powers-on with the switches in a

known state. All inputs signals passing through the switch must fall within the recommend operating conditions of

the TMUX1574 including signal range and continuous current. For this design example, with a supply of 3.3 V,

the signals can range from 0 V to 3.3 V when the device is powered. This example can also utilize the Powered-

off Protection feature and the inputs can range from 0 V to 3.6 V when VDD = 0 V. The max continuous current

can be 25 mA. Due to the voltage range and high speed capability, the TMUX1574 example is suitable for use in

SPI, JTAG, and I2S applications. Refer to Enabling SPI-based flash memory expansion by using multiplexers for

more information on using switches and multiplexers for SPI protocol expansion.

9.2.3 Application Curves

Two important specifications when using a switch or multiplexer to pass signals are the device propagation delay

and skew.

Figure 43. Propagation Delay and Skew Measurement

10 Power Supply Recommendations

The TMUX1574 operates across a wide supply range of 1.5 V to 5.5 V. Do not exceed the absolute maximum

ratings because stresses beyond the listed ratings can cause permanent damage to the devices.

Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD supply to

other components. Good power-supply decoupling is important to achieve optimum performance. For improved

supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF from VDD to ground.

Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance

connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series

resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive

systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to

the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall

inductance and is beneficial for connections to ground planes.

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