MPC9447

MOTOROLA

TIMING SOLUTIONS

8

OUTLINE DIMENSIONS

FA SUFFIX

LQFP PACKAGE

CASE 873A--03

ISSUE B

12 REF

D1

D/2

E

E1

1

8

9

17

25

32

F

F

e/2

DETAIL G

BASE

c1

c

b

b1

METAL

SECTION F--F

e

SEATING

PLANE

RR2

_

(S)

L

(L1)

0.25

GAUGE PLANE

A2

A

A1

DETAIL AD

DETAIL AD

D1/2

E1/2

E/2

4X

D

7

A

D

B

A--B

0.20 H

0.1 C

(1 )

_

8X

A, B, D

A--B

M

0.20

D

C

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

3. DATUMS A, B, AND D TO BE DETERMINED AT

DATUM PLANE H.

4. DIMENSIONS D AND E TO BE DETERMINED AT

SEATING PLANE C.

5. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED

THEMAXIMUM b DIMENSIONBYMORETHAN

0.08--mm. DAMBAR CANNOT BE LOCATED ON THE

LOWER RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSION AND ADJACENT LEAD OR

PROTRUSION: 0.07--mm.

6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.25--mm PER SIDE. D1 AND E1 ARE MAXIMUM

PLASTIC BODY SIZE DIMENSIONS INCLUDING

MOLD MISMATCH.

7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

8. THESE DIMENSIONS APPLY TO THE FLAT SECTION

OF THE LEAD BETWEEN 0.1--mm AND 0.25--mm

FROM THE LEAD TIP.

DIM

MIN

MAX

MILLIMETERS

A

A1

7.00 BSC

A2

0.80 BSC

b

9.00 BSC

b1

0.30

0.40

c

0.09

0.20

c1

0.09

0.16

D

D1

e

E

E1

L

L1

1.00 REF

R1

0.08

0.20

R2

S

1

1.40

1.60

0.05

0.15

1.35

1.45

0.30

0.45

0.08

------

07

__

_

9.00 BSC

7.00 BSC

0.50

0.70

θ

θ

0.20 REF

D

4X

A--B

0.20 C

D

6

6

4

4

DETAIL G

PIN 1 INDEX

C

32X

28X

H

5

8

PLATING

3

θ

θ

RR1

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

MPC9447

3.3V/2.5V 1:9 LVCMOS Clock Fanout Buffer

NETCOM

IDT™ 3.3V/2.5V 1:9 LVCMOS Clock Fanout Buffer

Freescale Timing Solutions Organization has been acquired by Integrated Device Technology, Inc

MPC9447

8