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ST25R100 датащи(PDF) 75 Page - STMicroelectronics |
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ST25R100 датащи(HTML) 75 Page - STMicroelectronics |
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75 / 86 page ![]() 7 Package information To meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 UFQFPN24 package information This UFQFPN is a 24-pin, 4 x 4 mm, 0.5 mm pitch, thermally enhanced ultra-thin fine pitch quad flat no lead package. Figure 22. UFQFPN24 - Outline 1 24 6 12 18 A1 PIN #1 ID B E A BOTTOM VIEW SIDE VIEW TOP VIEW FRONT VIEW C A3 E2 L 3Z_UFQFPN24_ME_V2 18 12 6 1 24 1. Drawing is not to scale. 2. Coplanarity applies to the exposed pad as well as the terminal. ST25R100 Package information DS14139 - Rev 5 page 75/86 |
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