MPC8555CPXAPF datasheet(71/88 Pages) FREESCALE

71 / 88 page

MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

16.2.2

Internal Package Conduction Resistance

For the packaging technology, shown in Table 49, the intrinsic internal conduction thermal resistance paths

are as follows:

•

The die junction-to-case thermal resistance

•

The die junction-to-board thermal resistance

Figure 44 depicts the primary heat transfer path for a package with an attached heat sink mounted to a

printed-circuit board.

Figure 44. Package with Heat Sink Mounted to a Printed-Circuit Board

The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is

conducted through the silicon and through the lid, then through the heat sink attach material (or thermal

interface material), and finally to the heat sink. The junction-to-case thermal resistance is low enough that

the heat sink attach material and heat sink thermal resistance are the dominant terms.

16.2.3

Thermal Interface Materials

A thermal interface material is required at the package-to-heat sink interface to minimize the thermal

contact resistance. For those applications where the heat sink is attached by spring clip mechanism,

Figure 45 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,

graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.

As shown, the performance of these thermal interface materials improves with increasing contact pressure.

The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a

thermal resistance approximately six times greater than the thermal grease joint.

Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see

Figure 41). Therefore, the synthetic grease offers the best thermal performance, especially at the low

interface pressure.

When removing the heat sink for re-work, it is preferable to slide the heat sink off slowly until the thermal

interface material loses its grip. If the support fixture around the package prevents sliding off the heat sink,

External Resistance

Internal Resistance

Radiation

Convection

Radiation

Convection

Heat Sink

Printed-Circuit Board

Thermal Interface Material

Package/Leads

Die Junction

Die/Package

(Note the internal versus external package resistance)

MPC8555CPXAPF датащи(PDF) 71 Page - Freescale Semiconductor, Inc

MPC8555CPXAPF датащи(HTML) 71 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88

датащи скачать

ссылки URL