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33989 датащи(PDF) 63 Page - Freescale Semiconductor, Inc |
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33989 датащи(HTML) 63 Page - Freescale Semiconductor, Inc |
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63 / 66 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 63 33989 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) Figure 63. Thermal Test Board Device on Thermal Test Board RθJA is the thermal resistance between die junction and ambient air. WD MISO SCLK GND GND GND GND CANL CANH L3 L2 L1 CS MOSI RX RST INT GND GND GND GND V2 V2CTRL VSUP HS1 L0 TX VDD1 4 5 6 7 8 9 10 11 12 13 14 2 3 28 25 24 23 22 21 20 19 18 17 16 15 27 26 1 33989 Pin Connections 28-Pin SOICW 1.27 mm Pitch 18.0 mm x 7.5 mm Body A Material: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness Outline: 80 mm x 100 mm board area, including edge connector for thermal testing Area A: Cu heat-spreading areas on board surface Ambient Conditions: Natural convection, still air Table 37. Thermal Resistance Performance Thermal Resistance Area A (mm2) °C/W RθJA 0 68 300 52 600 47 |
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