33889 datasheet(56/60 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33889

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

Introduction

This thermal addendum is provided as a supplement to the MC33889 technical

datasheet. The addendum provides thermal performance information that may be

critical in the design and development of system applications. All electrical,

application, and packaging information is provided in the datasheet.

Packaging and Thermal Considerations

The MC33889 is offered in a 28 pin SOICW, single die package. There is a

single heat source (P), a single junction temperature (TJ), and thermal resistance

(RθJA).

The stated values are solely for a thermal performance comparison of one

package to another in a standardized environment. This methodology is not

meant to and will not predict the performance of a package in an application-

specific environment. Stated values were obtained by measurement and

simulation according to the standards listed below.

Standards

Figure 23. Surface Mount for SOIC Wide Body

Non-Exposed Pad

28-PIN

SOICW

33889DW

DWB SUFFIX

EG SUFFIX (PB-FREE)

98ASB42345

28-PIN SOICW

NOTE FOR PACKAGE DIMENSIONS,

REFER TO THE 33889 DEVICE DATASHEET.

33889EG

RθJA

Table 34. Thermal Performance Comparison

Thermal Resistance

[

°C/W]

ΡθJA (1) (2)

ΡθJB (2) (3)

ΡθJA (1) (4)

ΡθϑΧ (5)

Notes

Per JEDEC JESD51-2 at natural convection, still air

condition.

2s2p thermal test board per JEDEC JESD51-7.

Per JEDEC JESD51-8, with the board temperature on the

center trace near the center lead.

Single layer thermal test board per JEDEC JESD51-3.

Thermal resistance between the die junction and the

package top surface; cold plate attached to the package top

surface and remaining surfaces insulated.

20 Terminal SOICW

1.27 mm Pitch

18.0 mm x 7.5 mm Body

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